Hier kann man das Mi-3 begutachten, wie es in einzelnen Schritten auseinander gebaut wird. In diesem Beispiel wird die nVidia Tegra4 Version gezeigt.
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On Sept 5 Xiaomi announced the release of its latest flagship handset the MI3. The the NVIDIA version of the MI 3 will be released first in mid-October and more information on the release date of the Qualcomm version is to follow. Today, we've obtained a prototype build of the NVIDIA version, which we plan to tear down for you here.
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The MI3's external design seems similar to that of the Nokia 920, but as we discovered when we removed the SIM card, the back is secured by two screws. One of which is covered by a protective Xiaomi sticker. Which means that those who want to change their battery at home may have to think about warranty issues (i.e. broken sticker = no more warranty).
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With the back plate removed we can see the internal layout (which should be largely the same for the Qualcomm version). As the body is only 8.1mm thin, it doesn't use a full length motherboard like the MI2\S.
5. The plastic plate fixes the mother board in place and blocks radiation and acts the antenna. Eight screws hold the plate in place.
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The MI3's NFC (near field communication) tag is contained in this black plate. Currently there are two popular methods for integrating NFC components. The first is putting the NFC tag in a separate plate (like we see above and like Oppo's Find5), the other is putting in it with the battery. Neither one seems to affect performance one way or the other.
7. This is a close up of the 3.5mm headphone input. Xiaomi has come out with a lot of products this year, and their earbuds have really been in a standout hit. More and more, Xiaomi is paying attention to sound quality and performance, and has upgraded a lot of the audio features in MIUI.
8. The bottom section of the back case houses the external speaker. More and more manufacturers are using modularized components, because they are easier to mass produce and a lot easier to replace. The bottom section also acts as an antenna.
9. Close up of the screws that held the back plate on.
10. Because the battery is so big and the body so slim (8.1mm) on the MI3, Xiaomi has started to use the mainstream three segment design, the same design appeared in the MI1. While it makes it easer to control the width of the phone, it's still hard to make the battery larger.
11. The MI3 uses a battery from Samsung (the MI3's predessors used batterys from LG and Sony. Samsung's batteries are no problem in terms of thickness and is just 64.71mm wide. As the phone itself is only 73.6mm wide it's hard to image fitting a larger battery in the same frame.
12. The upper motherboard.
13. This flexible printed circuit connects the bottom and top segments, and supports the micro-USB OTG (On-The-Go) feature, as well as the microphone (for calls).
14. The MI3 uses a full-size SIM slot. As Lei Jun has mentioned, 80% of Xiaomi owners use full-size SIM cards. Because of its large size, the slot is fixed directly to the circuit board.
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The high frequency IPEX coaxial connector is used for signal transmission. It outperforms other traditional transmitters which are fixed to the motherboard. In order to integrate this component, Xiaomi used a rubber strip (above the connector in the picture above).
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The middle piece of the case was manufactured in July 2013. According to Lei Jun, this prototype is the sixth iteration of the MI3. The design for the motherboard was probably finalized sometime in July, after which designers would begin to focus on the materials and colors used in the case.
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The ATMEL MXT540S chip has been around about a half a year, and not too many manufacturers are using it. The chip is used to control the phone's touch screen and also holds the technology behind the MI3s ultra-touch capabilities (i.e. you're able to use the touch screen with gloves on or with wet hands).
six months
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The front (top 13 mega-pixels) and rear (bottom 2 mega-pixels) cameras.
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Closeup of the back of the motherboard.
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Ah, the fabled Tegra 4. The MI3's Tegra 4 uses the all-new ARM Cortex-A15 architecture and features variable SMP (or the 4-PLUS-1 core setup). Samsung's Exynos 5 Dual (aka Exynos 5250) processor also used the Cortex-A15 architecture but ended up sticking with two-cores on account of power consumption concerns.
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2GB RAM from SKhynix is not bundled with the processor (as has been the case since the Tegra 2). I don't know if this is a conscious choice or if Tegra just doesn't support the technology.
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Broadcom's BCM4334 chip handles Wi-Fi and houses the technology behind the MI3's dual-band Wi-Fi (5G/2.4). Remember if you want to get 5G performance, your wireless router must support 5G as well.
23. Closeup of the Spreadtrum SC8803 chip which acts as the modem for the TD-SCDMA version (don't worry about this if you don't live in mainland China). There was some speculation that the MI3 would go beyond 3G, but clearly that was wishful thinking.
24. Closeup of the 2zc27 D9LQQ chip (which, as Google explains, is a Zener diode for constant voltage regulation).
25. Closeup of MAX77665A chip (involved in power management).
26. Closeup of INVENSENSE MPU-6050 (i.e. gyroscope) chip.
27. Closeup of the front of the motherboard. You'll notice that, unlike the chips on the back of the board, all the chips on the front have protective cases.
28. SanDisk solid state storage will come in 16GB (pictured) and 64GB
29. RF9812 chip from RFMD (As far as I can tell this has something to do with TD-SCDMA signals).
30. SPRD SR3500 RF transceiver chip (for radio).
31. 42L73CWZ chip from Cirrus logic (this handles audio output)
32. Haptic feedback motor (the thing that vibrates in the phone)
33. Ok, here's the takeaway: three-segment design, chips on the SoC are closely clustered, and the 3050mAh battery is a big highlight (both in terms of performance and design).
This was pretty easy to tear down and nothing broke unexpectedly (e.g. cases, chips, wiring). The MI3 will be easy to manufacture and repair. The phone is designed to effectively dissipate heat from the A15-cortex chip. In a nutshell, there are three “easys”: the phone is easy to tear down, it will be easy to repair, and it is easy to manufacture.